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Brand Name : WITGAIN PCB
Model Number : Half hole PCB0015
Certification : UL
Place of Origin : China
MOQ : 1 pcs/lot
Price : negotiable
Payment Terms : T/T
Supply Ability : 100k pcs/month
Delivery Time : 20 days
Packaging Details : Vacuum bubble bag packaging
PCB Kind : 4 Layer PCB
Material : FR4 TG130
Material Brand : KB6165
PCB Thickness : 1.0 MM
Solder Mask : Black
Min Lind Space&Width : 4/4 mil
4 Layer Half Hole PCB KB6165 Material 1.0 MM Thickness
Board Info:
1 Part NO: Half hole PCB0015
2 Layer Count: 4 Layer PCB
3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM
4 Solder Mask: Black 
5 Min Lind Space&Width: 4/4 mil
6 Application Area: Blue-tooth Module
7 Drillings: L1-L4 0.2MM Mechanical Drilling
8 PCB Size: 100mm*60mm/21pcs
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%
Our Capabilities:
| NO | Item | Capability | 
| 1 | Layer Count | 1-24 Layers | 
| 2 | Board Thickness | 0.1mm-6.0mm | 
| 3 | Finished Board Max Size | 700mm*800mm | 
| 4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) | 
| 5 | Warp | <0.7% | 
| 6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc | 
| 7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET | 
| 8 | Drill Hole Diameter | 0.1mm-6.5mm | 
| 9 | Out Layer Copper Thickness | 1/2OZ-8OZ | 
| 10 | Inner Layer Copper Thickness | 1/3OZ-6OZ | 
| 11 | Aspect Ratio | 10:1 | 
| 12 | PTH Hole Tolerance | +/-3mil | 
| 13 | NPTH Hole Tolerance | +/-1mil | 
| 14 | Copper Thickness of PTH Wall | >10mil(25um) | 
| 15 | Line Width And Space | 2/2mil | 
| 16 | Min Solder Mask Bridge | 2.5mil | 
| 17 | Solder Mask Alignment Tolerance | +/-2mil | 
| 18 | Dimension Tolerance | +/-4mil | 
| 19 | Max Gold Thickness | 200u'(0.2mil) | 
| 20 | Thermal Shock | 288℃, 10s, 3 times | 
| 21 | Impedance Control | +/-10% | 
| 22 | Test Capability | PAD Size min 0.1mm | 
| 23 | Min BGA | 7mil | 
| 24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc | 
|   | 
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